The trend in the 3G era is for mobile phone connectors to become smaller in size

With the acceleration of network speed and the increase of 3G applications, functions such as high-definition screens, high-resolution cameras, Bluetooth, WI-FI, GPS, FM, MP3, and even mobile TV will gradually become standard on mobile phones, and smartphones will also enter millions of households. However, according to the industry rules of consumer electronics in the past, while adding these functions, the overall price of mobile phones should not increase, which poses new problems for key component suppliers and mobile phone manufacturers. In response to this situation, there will inevitably be a trend towards integration and customization of mobile phone core ICs, and related passive components and connectors will also be smaller in size and have better performance. As a result, corresponding adjustments will be made to mobile phone manufacturing technology and processes to increase reliability and reduce manufacturing costs. According to ELEXCON Organizing Committee Creative Era, CMKC2009 will share with attendees the platform selection for entering the 3G mobile phone market, killer 3G terminal design ideas, 3G mobile phone turnkey solutions, and the survival methods of knockoff in the 3G era. In addition, mobile phone functions are becoming increasingly diverse, and DFM/DFX are also becoming more and more complex; Almost all major mobile phone manufacturers are now adopting 0201, 01005 components and PoP structure devices in their phones, and traditional mounting technology can no longer meet production needs; Moreover, under the impact of the economic crisis, low-cost manufacturing has become increasingly popular among mobile phone manufacturers, and many device and service providers have begun to attach importance to the low-cost manufacturing market; CMMF will focus on exploring these issues. In the past five years, CMMF has received strong support from companies such as Siemens, Panasonic, Fuji Machinery, Omron, Ambion, Global Instruments, Henkel, 3M, Sony Chemical, etc. The CMKC held for the first time last year also attracted the participation of MTK, Avago, Numonyx, Murata, Vishay, and Duntai Technology. The two forums have attracted more than 2400 professional engineering and technical personnel, production and manufacturing management personnel, and corporate executives from mobile phone manufacturers, OEM/ODM/EMS manufacturers, and Design House. This year's lineup of speakers will be stronger and the content will be more diverse. In addition to the "Mobile Phone Design and Manufacturing" series of seminars, the ELEXCON exhibition hall is also the most important platform for manufacturers to promote. Companies such as TDK, Omron, Panasonic Electric, and Nitto Denko will exhibit various components, materials, and related manufacturing technologies applied to mobile phones and other 3G terminals. The exhibition and conference form a good interaction, jointly accelerating the improvement of China's mobile phone design and manufacturing technology.